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Shenzhen Huwei Precision Circuit Co., Ltd.
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6 Layers Cell phone PCB with immersion gold

6 Layers Cell phone PCB with immersion gold

Number of Layers : 6-Layer
Base Material : FR4 TG170
Copper Thickness : 1/1OZ
Board Thickness : 1.6mm
Min. Hole Size : 0.35mm
Min. Line Width : 12mil
Min. Line Spacing : 10mil
Surface Finishing : immersion gold
solder mask color : green
silkscreen color : white
MOQ : 1 Piece/Pieces
Packaging Details : 20-25pcs by vacuum-packed then to carton box
Delivery Time : 4-15days
Payment Terms : L/C,T/T,Western Union,Paypal
Supply Ability : 10000 Square Meter/Square Meters per Month
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NO MOQ
1.double layers PCB with immersion gold
2.Base material: FR-4 based with TG170
3.Board thickness:1.6mm

NO MOQ

1.6 layers PCB with immersion gold surface treatment

2.Base material: FR-4 based with TG170

3.Board thickness:1.6mm

4.Copper thickness:1/1 OZ

5.Min line width :12mil

6.Min line spacing: 10mil

7.soldermask color: green

8.low price and good quality.

9.4-7days small order;8-15days mass order

10.ISO9001, UL, ROHS,SGS complianted

UL:E320045

ROHS: A001C100827049001-2

SGS: CANEC1000312001

ISO9001:2000:110801011

With 9 years experience We can do for you:

1-16 layer FR-4 PCB board, 1-2 layer Aluminum PCB

1-6 oz copper thickness

0.2 mm hole size

0.1 mm line width/space

Our PCBs are used for wide range of electronic products,

Like Inverter, Medical devices, CCTV, Power supply, GPS, UPS, Set-top Box, Telecomunication ,LED, etc.


Our Factory Manufacture Capability.

Item

Manufacture Capability

Material

FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3, Aluminium, Metal based

Layer No.

1-16

Finished Board thickness

0.2 mm-3.8mm’(8 mil-150 mil)


Board Thickness Tolerance

±10%

Cooper thickness

0.5 OZ-6OZ (18 um-210 um)

Copper Plating Hole

18-40 um

Impedance Control

±10%

Warp&Twist

0.70%

Peelable

0.012"(0.3mm)-0.02’(0.5mm)

Images

Min Trace Width (a)

0.1mm (4mil)


Min Space Width (b)

0.1mm (4 mil)

Min Annular Ring

0.1mm (4 mil)


SMD Pitch (a)

0.2 mm(8 mil)


BGA Pitch (b)

0.2 mm (8 mil)


0.05mm

Solder Mask

Min Solder Mask Dam (a)

0.0635 mm (2.5mil)


Soldermask Clearance (b)

0.1mm (4 mil)

Min SMT Pad spacing (c)

0.1mm (4 mil)

Solder Mask Thickness

0.0007"(0.018mm)

Holes

Min Hole size (CNC)

0.2 mm (8 mil)

Min Punch Hole Size

0.9 mm (35 mil)

Hole Size Tol (+/-)

PTH:±0.075mm;NPTH: ±0.05mm

Hole Position Tol

±0.075mm

Plating

HASL

2.5um

Lead free HASL

2.5um

Immersion Gold

Nickel 3-7um Au:1-5u''

OSP

0.2-0.5um

Outline

Panel Outline Tol (+/-)

CNC: ±0.125mm, Punching: ±0.15mm

Beveling

30°45°

Gold Finger angle

15° 30° 45° 60°

Certificate

ROHS, ISO9001:2008, SGS, UL certificate








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