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Shenzhen Huwei Precision Circuit Co., Ltd.
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Cell phone PCB

Cell phone PCB

Base Material : FR4
Copper Thickness : 2 oz
Board Thickness : 1.0mm
Min. Hole Size : 0.25mm
Min. Line Width : 0.2mm
Min. Line Spacing : 0.15mm
Surface Finishing : Immersion Gold
Green soldler mask : White silkscreen
MOQ : 1 Piece/Pieces
Packaging Details : Vacuum Packaging
Delivery Time : 7 days
Payment Terms : L/C,T/T,Western Union,Cash
Supply Ability : 10,000 Square Meter/Square Meters per Month
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We have been providing quality and competitive Cell phone PCB for many large Chinese and foreign mobile phone companies.
  1. 1-12layers PCB
  2. Surface treatment
    Unlead solder leveling
    HASL
    Gold pleting
    Chemical termenic(≥4 microinch)
    Selective Gold Dry Film Lamination
    (OSP) Surface treatment
    Immersion silver
  3. Production cycle

Double-side boards

Multi-layer boards

sample

3-5 day

5-7 day

News order

7-9 day

8-11 day

Repeat order

5-7 day

7-9 day


CELL PHONE PCB AND OTHERS











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